CI-TLM1400 Series

Automatic Board Thickness Measuring System

Product Overview

The CI-TLM1400 Series Automatic Board Thickness Measuring System is specifically designed for high-precision, online, non-contact thickness measurement of panel and board products.
By integrating advanced measuring technologies, it provides fast, accurate, and reliable thickness measurement for various board materials, with dependable data transmission capability—making it an ideal solution for modern panel production lines.

Key Features & Advantages

• High-precision measurement: Delivers excellent accuracy to meet stringent quality control requirements.
• Non-contact / contact options: Measurement method can be selected according to board material and operating conditions.
• Online measurement: Enables real-time, continuous thickness monitoring directly on the production line.
• No surface damage: Non-contact sensors are especially suitable for fragile or soft materials.
• Multi-point measurement: Supports single-point, multi-point scanning, or multiple sensor heads for comprehensive thickness profiling.
• Wide application range: Suitable for ambient, hot-rolling, and soft material applications.
• Data integration: Multiple interfaces available for easy integration with higher-level process control systems.

Measuring Principle & Configuration

1. Non-Contact Laser Measurement

• Principle: Upper and lower opposing non-contact laser displacement sensors are installed on the machine frame to measure board thickness.
• Function: Supports single-point or multi-point scanning measurements, or multiple sensor head installations to meet thickness inspection requirements across wide panels.
• Advantages:
Non-contact measurement prevents surface damage and is suitable for various production environments.
With optional cooling and dust-protection devices, the system can be applied to hot-rolled materials and soft boards that are difficult to measure using conventional methods.

Data Transmission Interfaces

• System integration: Supports multiple interfaces, including Ethernet with TCP/IP, allowing measurement data to be transmitted to higher-level process control systems.

Applicable Board Types (Application References)

This system is suitable for thickness measurement of a wide range of rigid and flexible boards, including but not limited to:

• Wood-based panels:
Particleboard, Fibreboard, OSB, Plywood, HDF, Hardboard

• Building materials:
Gypsum board, Mineral fibre, Wood cement

• Solid wood & surface materials:
Solid wood, Veneer

• Plastics & rubber:
Plexiglass, Rubber

• Others:
(Customized upon request)

⚙️ Technical Specifications

Measuring Accuracies